IPO Profile

Viasystems Group
101 South Hanley Road, Suite 400, St. Louis, Missouri 63105
Tel: 314-727-2087
Web: www.viasystems.com
Ticker: VIAS
Stock Exchange: Nasdaq
Shares Issued: 0.00
Price Offered: $0.00
Amount Raised: $316,250,000.00

Underwriters:
Goldman Sachs & Co.
J.P. Morgan
Lehman Brothers
Thomas Weisel Partners LLC
UBS Investment Bank

Company Description:
We are a leading worldwide provider of complex multi-layer printed circuit boards, wire harnesses and electro-mechanical solutions. Our products are used in a wide range of applications, including automotive dash panels and control modules, major household appliances, data networking equipment, telecommunications switching equipment and complex medical and technical instruments. We have 15 facilities in five countries around the world, which are strategically located to maximize the benefits delivered to our customers and to optimize our operations. Our facilities in North America and Europe offer technologically advanced products and services, while our facilities in China and Mexico offer high-quality, high-volume production at low costs. We employ best practices among our globally integrated facilities to actively migrate technology from North America and Europe to China and Mexico. Approximately 92% of our employees are located in six facilities in China and four facilities in Mexico